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ULPN-266 laser is designed for micro-cutting, drilling, texturing, marking and selective material removal
on challenging materials such as glass, diamond and Teflon. Exceptional IPG non-linear crystal robustness
enables industry-leading laser realiability and stability of process parameters. The pulse energy is nearly
independent of pulse repetition rate, resulting in the highest productivity at the maximum average power.
Specification
| Opticals | Specification | |
| Wavelength, nm | 266 | |
| Mode of Operation | Pulsed | |
| Output Power, W | Up to 10 | |
| Power Tunability, % | 10-100 | |
| Pulse Energy, µJ | Up to 2 | |
| Pulse Duration, ns | 1.3 | |
| Repetition Rate, kHz | 100-2700 | |
| Beam Mode Quality, M² | <1.2 | |
| General | Specification | |
| OEM Laser Module Dimensions (W × D × H), mm | 270 × 256 × 89 | |
| Optical Head Dimensions (W × D × H), mm | 142 ×345 × 80 | |
| Optical Head Weight, kg | 5 | |
| Cooling | Optical Head – Passive Conductive Laser Module – Forced Air | |
| Supply Voltage, VDC | 24 | |
| Power Consumption, W | <200 | |
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